View FMM5709X_1240976.PDF datasheet online --- IC-ON-LINE

Datasheet File OCR Text:

FMM5709X
K / Ka Band Low Noise Amplifier MMIC
FEATURES Low Noise Figure : NF = 2.5dB ( Typ.) @ f=30GHz High Associated Gain : Gas = 23dB ( Typ.) @f=30GHz Broad Band : 17.5 ~ 32GHz High Output Power : P1dB = 12.5dBm ( Typ. ) @f=30GHz Impedance Matched Zin/Zout = 50 DESCRIPTION The FMM5709X is a LNA MMIC designed for applications in the 17.5 - 32 GHz frequency range. This product is well suited for satellite communications, radio link, and applications where low noise and high dynamic range are required. Eudyna's stringent Quality Assurance Program assures the highest reliability and consistent performance.
ABSOLUTE MAXIMUM RATING Item Drain Voltage Input Power Storage Temperature
Symbol VDD Pin Tstg
Rating 4 -3 -65 to +175
Unit V dBm o C
RECOMMENDED OPERATING CONDITIONS Item Symbol Drain Voltage VDD Operating Backside Temperature Top
Recommend <=3 -45 to +85
Unit V o C
ELECTRICAL CHARACTERISTICS (Ambient Temperature Ta=25o C) Item Noise Figure Associated Gain Output Power at 1dB G.C.P. Output 3rd order intercept point Drain Current at 1dB G.C.P. Input Return Loss Output Return Loss Symbol NF Gas P1dB OIP3 Iddrf RLin RLout Test Conditions Limits Min. 20 Typ. 2.5 23 12.5 22.5 60 -10 -10 ~ 199V Max. 3.0 26 75 Unit dB dB dBm dBm mA dB dB
VDD=3V f=30GHz ZL=ZS=50ohm
Class 0 ESD Note : Based on EIAJ ED-4701 C-111A(C=100pF, R=1.5kW)
Edition 1.1 July 2004
1
FMM5709X
K / Ka Band Low Noise Amplifier MMIC
NOISE FIGURE, ASSOCIATED GAIN vs. FREQUENCY
VDD=3V
12 11 10 9 8 7 6 5 4 3 2 1 0 30 25 P1dB [dBm], G1dB [dB] Associated Gain [dB] 20 15 10 NF 5 0 16 18 20 22 24 26 28 30 32 34 36 38 40 Frequency [GHz] 26 24 Gas 22 20 18 16 14 12 10
P1dB
P1dB, G1dB vs. FREQUENCY
VDD=3V
Noise Figure [dB]
8 6
G1dB
16 18 20 22 24 26 28 30 32 34 36 Frequency [GHz]
OUTPUT POWER vs. INPUT POWER
VDD=3V
16 14 Output Power [dBm] 12 10 8 6 4 2 -22 -20 -18 -16 -14 -12 -10 -8 Input Power [dBm] -6 -4 -2
18GHz 22GHz 26GHz 30GHz 32GHz
GAIN vs. INPUT POWER
VDD=3V
26 24 22 20
18GHz
Gain [dBm]
18 16 14
22GHz 26GHz 30GHz 32GHz
-22 -20 -18 -16 -14 -12 -10 -8 Input Power [dBm]
-6 -4 -2
2
FMM5709X
K / Ka Band Low Noise Amplifier MMIC
IMD PERFORMANCE vs. TOTAL OUTPUT POWER
VDD=3V, f=+10MHz
0 Intermodulation Distortion [dBc]
18GHz
-10 -20 -30 -40 -50 -60 -70 -2 0
22GHz 26GHz 30GHz 32GHz
IM3
IM5
2
4
6
8
10 12 14 16
2-Tone Total Output Power [dBm]
SMALL SIGNAL GAIN vs. FREQUENCY
VDD=3V
30 25 20 15 10 5 0 -5 -10 -15 -20 -25 -30 0 5 10 15 20 25 30 35 40 Frequency [GHz]
INPUT/OUTPUT RETURN LOSS vs. FREQUENCY
VDD=3V
10 5 Return Loss [dB] 0 -5 -10 -15 -20 -25 -30 0 5 10 15 20 25 30 35 40 Frequency [GHz]
Input Output
Small Signal Gain [dB]
3
FMM5709X
K / Ka Band Low Noise Amplifier MMIC
S-Parameter
VDD=3V FREQ. [MHz] 1000 2000 3000 4000 5000 6000 7000 8000 9000 10000 11000 12000 13000 14000 15000 16000 17000 18000 19000 20000 21000 22000 23000 24000 25000 26000 27000 28000 29000 30000 31000 32000 33000 34000 35000 36000 37000 38000 39000 40000 S11 mag. 0.959 0.955 0.952 0.946 0.938 0.930 0.919 0.906 0.890 0.878 0.860 0.828 0.769 0.657 0.488 0.319 0.222 0.210 0.233 0.266 0.304 0.342 0.376 0.402 0.424 0.441 0.444 0.437 0.439 0.447 0.441 0.457 0.453 0.414 0.365 0.276 0.188 0.112 0.053 0.005 ang. -25.9 -51.0 -75.9 -99.9 -123.2 -146.1 -168.5 169.2 146.8 123.8 98.9 71.7 40.9 6.8 -27.9 -54.0 -66.7 -73.7 -91.4 -112.2 -134.9 -155.9 -177.1 162.2 141.7 123.4 105.3 88.5 72.7 57.9 42.1 25.4 5.3 -17.9 -43.2 -67.3 -89.6 -107.1 -116.3 56.6 mag. 0.008 0.019 0.035 0.031 0.018 0.012 0.009 0.086 0.233 0.161 0.138 0.655 1.666 3.671 7.153 11.694 15.274 16.572 16.251 15.490 15.034 14.888 14.901 15.063 15.153 15.263 15.068 14.910 14.657 14.717 14.839 14.982 15.122 14.577 12.651 10.093 7.902 6.067 4.710 3.687 S21 ang. -156.9 154.9 65.7 -22.8 -92.8 -102.3 -106.0 -80.9 175.3 97.4 156.8 122.9 71.2 17.1 -44.3 -111.8 -179.8 117.2 61.8 13.4 -30.5 -71.8 -111.9 -151.4 169.5 130.8 92.7 55.4 18.6 -18.1 -54.9 -93.4 -133.5 -176.8 139.2 97.6 59.6 26.8 -3.9 -31.8 mag. 0.001 0.001 0.001 0.001 0.001 0.001 0.001 0.000 0.001 0.001 0.001 0.001 0.002 0.001 0.001 0.002 0.001 0.002 0.002 0.003 0.002 0.002 0.004 0.001 0.002 0.005 0.003 0.004 0.003 0.003 0.002 0.005 0.006 0.008 0.004 0.005 0.007 0.006 0.010 0.010 S12 ang. -10.3 -25.6 -171.1 173.6 -1.3 -133.3 147.2 131.7 161.3 136.4 89.5 149.3 13.5 -15.4 110.3 -133.8 -93.7 -103.6 83.2 159.7 101.3 122.4 118.6 -5.9 64.4 43.5 1.9 24.1 -31.2 -48.2 6.4 -11.1 -132.4 103.9 109.2 161.1 42.3 63.4 23.4 16.7 mag. 0.997 0.983 0.908 0.858 0.816 0.771 0.770 0.586 0.415 0.303 0.217 0.179 0.165 0.162 0.155 0.159 0.170 0.158 0.146 0.115 0.090 0.079 0.099 0.130 0.165 0.196 0.209 0.222 0.221 0.213 0.202 0.179 0.196 0.238 0.327 0.355 0.401 0.416 0.446 0.459 S22 ang. -19.1 -39.1 -59.1 -75.7 -94.7 -112.0 -137.7 -168.1 176.9 162.8 156.2 156.1 154.9 149.5 141.8 136.8 122.7 109.1 91.6 80.0 81.2 90.9 98.6 94.2 86.2 69.3 52.1 33.2 14.3 -1.9 -16.6 -22.8 -29.9 -43.6 -69.5 -98.2 -127.4 -152.8 179.1 160.2
4
FMM5709X
K / Ka Band Low Noise Amplifier MMIC
THERMAL INFORMATION (REFERENCE DATA)
VDD=3V, IDD=60mA Tch 18 Unit o C
MTTF vs Tch
1.E+09 1.E+08 1.E+07 MTTF (hrs) 1.E+06 1.E+05 1.E+04 1.E+03 1.E+02 60 80 100 120 140 160 180 200 220 240 260 280 Channel Temperature (deg-C) Channel Temperature (OC)
Ea=1.02eV
5
FMM5709X
K / Ka Band Low Noise Amplifier MMIC
Chip Outline and Bonding Pad Locations (Dimension in Micro-Meters)
1440
RF-out 870 RF-in 680
140 0
0
140
670 VDD
1130
1470 1650
Chip Size : 165030m x 144030m Chip Thickness : 85m20m Bonding Pad Size : RF-Pad : 80m x 160m VDD-Pad : 80m x 80m
6
FMM5709X
K / Ka Band Low Noise Amplifier MMIC
BONDING LAYOUT / EXTERNAL CIRCUIT
50 Line
RF Input
RF Output
50 Line
100pF
1F
VDD
"Copper" is recommended material of the package or carrier.
7
FMM5709X
K / Ka Band Low Noise Amplifier MMIC
DIE ATTACH 1) The die-attach station must have accurate temperature control, and an inert forming gas should be used. 2)Chips should be kept at room temperature except during die-attach. 3) Place package or carrier on the heated stage. 4) Lightly grasp the chip edges by the longer side using tweezers. Die attach conditions Stage Temperature : 300 to 310 deg.C Time : less than 15 seconds AuSn Perform Volume : per next Figure
500 Volume of Au-Sn Perform (10 -3/mm 3)
400
300
FMM5709X
200
100
0 0 1 2 3 4 5 Area of Chip Back Surface (mm^2)
WIRE BONDING The bonding equipment must be properly grounded. The following or equivalent equipment, tools, materials, and conditions are recommended. 1) Bonding Equipment and Bonding Tool. Bonding Equipment : West Bond Model 7400 (Manual Bonder) Bonding Tool : CCOD-1/16-S-437-60-F-2010-MP (Deweyl) 2) Bonding Wire Material : Hard or Half hard gold Diameter : 0.7 to 1.0 mil 3) Bonding Conditions Method : Thermal Compression Bonding with Ultrasonic Power Tool Force : 0.196 N +/- 0.0196 N Stage Temperature : 215 deg.C +/- 5 deg.C Tool Heater : None Ultrasonic Power Transmitter : West Bond Model 1400 Duration : 150 mS/Bond
8
FMM5709X
K / Ka Band Low Noise Amplifier MMIC
Eudyna Devices USA Inc. 2355 Zanker Rd. San Jose, CA 95131-1138, U.S.A. TEL: (408) 232-9500 FAX: (408) 428-9111 www.us.eudyna.com Eudyna Devices Europe Ltd. Network House Norreys Drive Maidenhead, Berkshire SL6 4FJ United Kingdom TEL: +44 (0) 1628 504800 FAX: +44 (0) 1628 504888 Eudyna Devices Asia Pte. Ltd. Hong Kong Branch Rm.1101,Ocean Centre, 5 Canton Road Tsim Sha Tsui, Kowloon, Hong Kong TEL: +852-2377-0227 FAX: +852-2377-3921 Eudyna Devices Inc.
Sales Division 1, Kanai-cho, Sakae-ku Yokohama, 244-0845, Japan
CAUTION
Eudyna Devices Inc. products contain gallium arsenide (GaAs) which can be hazardous to the human body and the environment. For safety, observe the following procedures: Do not put these products into the mouth. Do not alter the form of this product into a gas, powder, or liquid through burning, crushing, or chemical processing as these byproducts are dangerous to the human body if inhaled, ingested, or swallowed. Observe government laws and company regulations when discarding this product. This product must be discarded in accordance with methods specified by applicable hazardous waste procedures. Eudyna Devices Inc. reserves the right to change products and specifications without notice.The information does not convey any license under rights of Eudyna Devices Inc. or others.
(c) 2004 Eudyna Devices USA Inc. Printed in U.S.A.
TEL +81-45-853-8156 FAX +81-45-853-8170
9

▲Up To Search▲

Price & Availability of FMM5709X

	To Download FMM5709X Datasheet File
If you can't view the Datasheet, Please click here to try to view without PDF Reader .